Die-Cut Thermal Management Materials

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Components using thermal interface materials, such as die-cut thermal gap pads, provide a path for heat transfer between a heat-generating device and a heat sink or cooling plate.

As our world becomes more connected, we are using more electronic devices that use and store energy. Where there is electric current, there is heat, and heat generated must be transferred away to keep the device running within safe operational temperatures. Too much heat can cause poor device efficiency and even device failure, making thermal management a key requirement for many components.

Thermal Gap Pads, Gap Fillers, Thermal Bonding Tapes, Foil Heat Spreaders, Thermally Conductive Foams

Thermal interface materials are lightweight and easy to handle. Die-cut thermal gap pads and gap fillers, conductive tapes, and foils are often utilized over greases and liquid adhesives due to easy application and consistent performance. Marian can help design and manufacture thermal management components to meet the specifications of your application.

Choosing the Best Thermal Management Materials

Partnering with an expert in thermal interface materials and an industry-leading converter will drastically improve your selection process. Marian’s material experts collaborate with you to fully understand the details of the thermal interface and design challenges. Based on our long history of working with these materials, we are able to suggest the most ideal material and configuration for your assembly.

Material Samples, Rapid Prototypes

Your design process likely demands a range of testing prior to approval of the final material. Marian can provide material samples and rapid prototypes using a number of prototyping capabilities, including laser, water jet, and blade cutting plotters.